Is Your Cooling Strategy Keeping Pace?

The fundamental assumptions of data center design have shifted. As AI, Machine Learning, and HPC drive rack densities from a traditional 5 kW to well over 100 kW per cabinet, legacy air-based systems are hitting a physical wall. Air can only carry limited thermal energy, leading to inefficient "hot spots" and skyrocketing energy costs.

Data Centre Cooling Technology Comparison Matrix

Which Cooling Solution is right for you? The below comparison allows you to choose the right solution based on your specific density requirements and infrastructure goals.

Cooling Technology	Typical Use Case	Density (per rack)	Key Strengths	Limitations
CRAC + Aisle Containment	Traditional enterprise & low-density facilities	3–10 kW	Simple, proven, and requires low maintenance	High energy usage; limited to lower densities; risk of bypass airflow
Fan Wall (Cool Wall)	Large-scale / Hyperscale and Slab-based builds	5–15 kW	Uniform air distribution; centralized maintenance outside IT rows	Large footprint; inflexible for localized high-density loads; risk of overcooling
In-Row Cooling	Medium densities and retrofit scenarios	5–15 kW	Targeted cooling; scalable units; reduces air mixing compared to CRAC	Consumes valuable rack space; fixed unit capacity limits; design changes for scaling
Rear Door Heat Exchanger (RDHX)	High-density AI/HPC and Retrofits	15 kW up to 120 kW	Space-saving; adaptive/self-regulating; eliminates heat buildup in the hall	Requires chilled water infrastructure
Direct to Chip Cooling (On-Chip)	AI clusters and HPC environments	>100 kW	Precision cooling at the source (CPU/GPU); handles extreme heat loads	Only cools 60-90% of heat; requires secondary cooling for residual heat (memory/PSU)
Immersion Cooling	Ultra-high density and specialized deployments	100 kW to 400 kW+	Highest efficiency (PUE < 1.05); silent operation; no airflow constraints	Requires full facility redesign/specialized tanks; maintenance complexity

A Winning Combination: RDHx + On-Chip : The hybrid cooling formula built for AI heat

Name: LP - Solving the Cooling Dilemma
Brand: Legrand

The hybrid strategy of RDHX and On-Chip is the winning formula because it pairs precision cooling at the processor level with the power to capture the 10–40% of residual heat that traditional air cooling simply can no longer manage!

Ready to Optimize Your White Space?

At Legrand, we don’t just provide hardware; we provide the "Winning Formula." By combining our Rear Door Heat Exchangers (RDHX)with On-Chip Cooling , we enable a hybrid strategy that removes heat at the source and manages residual thermal loads with up to 93% energy efficiency. Whether you are retrofitting a low-density site like NorthC or supporting world-class research at CERN, our specialized brands—including USystems and Minkels—ensure your infrastructure is resilient, scalable, and sustainable. Don't let legacy cooling limit your compute potential. Join the leaders in high-density infrastructure.

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Adopting the energy-efficient RDHx technology has been a game-changer for us. The fact that it enables high-density computing while reducing energy consumption makes it a compelling choice to meet AI and HPC requirements.

WOLFGANG VOIGT

Münchenstein data center site manager - NorthC